With the blooming of plum blossoms, "The Hometown of Yan Emperor, The Capital of Power" - Zhuzhou spreads "good news." On December 30, 2022, the grand completion ceremony of MTM Packaging Project, located beside Yunxia Avenue in Zhuzhou Economic Development Zone, was held. During the ceremony, Wang Tingkai, member of the Zhuzhou Municipal Party Committee and Deputy Mayor, announced the official completion of the "MTM Packaging Project."

Hunan More Than Moore Advanced Semiconductor Co., Ltd. is a joint venture between Zhuzhou State-owned Investment Group, Shanghai Xingcheng Capital and a technology team. MTM focuses on high-performance chip and high-density packaging applications, equipped with leading packaging solution development capabilities, excellent design and simulation capabilities, and competitive processing and delivery capabilities. MTM is a high-tech company in the industry that leads in high-density system-level integrated advanced packaging technology. MTM has been recognized as a "National High-Tech Enterprise," officially joining the ranks of national high-tech enterprises. In October, when the air was crisp and the harvest was abundant, it was honored as the specialized and sophisticated SMEs in Zhuzhou.

The International Innovation More Than Moore Advanced Packaging Project was signed and introduced in September 2020, located next to Yunxia Avenue in Zhuzhou Economic and Technological Development Zone, with a planned land area of 220 acres, including 100.96 acres for the first phase. The project started construction in March 2021, with a planned workshop of 90000 square meters and supporting buildings of 10000 square meters. As of now, a total investment of 762 million yuan has been completed. Build HPC module system level packaging line (SiP), produce a variety of products including IoT, artificial intelligence, supercomputing, autopilot, Genetic testing, aerospace and other products, and build a world-class semiconductor packaging industry base with advanced technology and diversified products.

After the project is put into operation, it can achieve a breakthrough in the localization of ultra large GPU/CPU packaging and testing production lines. At the same time, relying on leading system level packaging services, it attracts high-quality upstream and downstream enterprises to gather in Zhuzhou, focusing on building Zhuzhou into an advanced packaging supply chain center for high-density chips and HPC modules. After the first phase reaches its full capacity, it can provide 1000 job opportunities, with an estimated annual output value of 1.658 billion CNY and an annual tax revenue of 164 million CNY.